Supports Intel® 14th/13th/12th Generation Alder Lake Core™ CPU (LGA1700, 35/65W TDP)
Intel® Q670E chipset, integrated Intel® UHD Graphics 770
Max. 64 GB DDR5 4800 MHz SDRAM (2 x SO-DIMM)
Up to 6 x 2.5 GbE/GbE LAN with screw lock (must be ordered separately. 1 x 2.5 GbE + 1 x GbE on 2-port models / 5 x 2.5 GbE + 1 x GbE on 6-port models)
Can be ordered IEEE 802.3at PoE+ PSE on 2.5GbE port 3-6, total PoE budget 100 W
1 x USB 3.2 Gen2x2 (20 Gbps) Type-C with screw lock
4 x USB 3.2 Gen2x1 (10 Gbps) type-A + 2 x USB 3.2 Gen1x1 (5 Gbps) type-A
2 x USB 2.0 ports
1 x VGA, 1 x DVI-D, 1 x DisplayPort (up to 4K resolution)
COM: 2 x RS-232/422/485 (COM1/COM2, software configurable) + 2 x RS-232 (COM3/COM4)
2 x internal SATA ports for 2.5" HDD/SSD (RAID 0/1 on E/P/DE models) or 1 x hot-swap 2.5" SSD/HDD + 1 x internal SATA (LP models)
1 x M.2 2280 (PCIe Gen4 x4) for NVMe SSD (up to ~7000 MB/s)
Patented cassette for expansion with PCIe/PCI cards:
Version 1: 1 x PCIe x16 Gen3
Version 2: 2 x PCIe x16 Gen3
Version 3: 1 x PCI slot
1 x mini PCIe (full size)
1 x M.2 2242/3052 B with nano-SIM for 4G/5G modem
1 x expandable (extra COM, digital I/O, more GigE/PoE, USB, etc.)
8–48 V DC input via 3-pin terminal block
Remote on/watchdog/LED output via separate 3-pin terminal block
Fanless, industrial design – tested to MIL-STD-810G for vibration and shock
Operating temperature (depending on CPU configuration):
-25 ~ 70 °C with 35 W CPU
-25 ~ 50 °C with 65 W CPU (full TDP)
Wall mounting as standard, DIN rail mounting as an option
Certification: CE/FCC Class A
Many versions, contact our sales department