Model 0: No PCI/PCIe expansion

Model 1: 1 x PCI/PCIe slot

Model 2: 2 x PCI/PCIe slots - supports GPU cards up to 130W

CPU: Intel® Core™ i9/i7/i5/i3 (14th/13th/12th generation, LGA1700, max. 65W TDP)

RAM 2x DDR5 SO-DIMM, ECC/non-ECC, up to 5600 MHz, max. 64 GB

2x 2.5" SATA

3x mSATA sockets

1x M.2 Key M for NVMe SSD

2x GbE LAN (upgradable to 2x 10 GbE LAN upon order)

Up to 2x PCI/PCIe slots

1x M.2 + 2x Full-size Mini PCIe

Support for CMI and CFM modules (including for I/O expansion, ignition control, and PoE+)

2x DisplayPort

1x VGA

Up to 8x USB (USB 3.2 Gen2 and USB 2.0)

4x COM (RS-232/422/485)

9–48 VDC input, with ignition control

Operating temperature: -40 °C to 70 °C

Certifications: Military: MIL-STD-810G, Transportation: EN50155 (EN 50121-3-2), Safety: UL, cUL, CB, IEC/EN 62368-1

Supports Intel® OpenVINO™

Intel® ESDQ Certified: Edge Insights for AMR Software Stack

The system is assembled according to your needs. Contact us for advice and pricing.

Rugged embedded PC for industrial edge AI, machine vision, and deep learning

Supports 12th/13th/14th Gen Intel® Core™ processors (up to 65 W)

Supports up to 96 GB DDR5 memory

Dual or single full-length GPU expansion option with combined 500 W power budget

4× hot-swappable 2.5" SATA bays + multiple M.2 slots 

Supports RAID 0 / 1 / 5 / 10

4× 2.5GbE LAN (optional 10GbE), 6x USB 3.2 Gen1x1 , 2x RS-232/422/485

Modular design for scalable I/O with expansion modules (CMI/CFM)

Temperature operation: –40 °C to 70 °C (depending on CPU config)

Power input: 9 - 48VDC

Os support: Windows 10/11, Ubuntu 22.04 LTS

Certified to MIL-STD-810H and other industrial standards for shock, vibration, and safety

Fanless design (embedded heat pipe cooling solution)

12/13 generation CoreTM i9/i7/i5/i3 processor (Alder Lake-S/Raptor Lake-S)

Up to 60W GPU MXM module expansion

802.3af (15.4W)/802.3at(25.5W) Gigabit PoE ports

DP x2 + HDMI x 1 and DVI x 1 (supports 4 independent displays)

On/off delay control / configurable ignition current control

Supports TPM 2.0 and Time-Sensitive Networking (TSN)

Two mPCIe for optional WiFi/3G/4G/GPS or I/O expansion supported

Front-accessible I/O

1 x M.2 B for storage or 5G/LTE +1 x M.2 E-key for WiFi/BT

1 x M.2 M for NVMe SSD

285x230x 90 mm (9.84" x11.50" x 3.54"), fanless 285x230x110 mm (9.84" x11.50" x 4.33"), w/ FAN

DC 9~36V input

CE, FCC Class A, E-mark

optional extras