Intel® Core™ Ultra processor (Meteor Lake-H)

2 versions:

Intel® Core™ Ultra 7 processor 155H (16 cores, 28W TDP)

Intel® Core™ Ultra 5 processor 125H (14 cores, 28W TDP) Standard model

Equipped with multiple compute units, CPU, GPU (Intel® Arc™ GPU, applicable to H-series) and NPU (Intel® AI Boost), the system delivers high performance and efficient AI acceleration in a single platform.

Supports DDR5-5600 SO-DIMM memory, up to a maximum of 96 GB.

4 x USB 3.2 Gen.2 (Type-A)

2 x USB 2.0 (Type-A)

1 × USB Type-C (DisplayPort/USB 10Gbps support)

1 x USB (DisplayPort/USB 10Gbs with 30W power delivery support)

1 × HDMI 1.4b

3 × DisplayPort (of which 2 via USB Type-C).

3 x 2.5 GbE LAN ports with TSN (Time-Sensitive Networking)

1 x 1GbE port.

2 x 2.5" swappable HDD/SSD bays

1 x full-size PCI Express Mini Card (USB + PCIe signal)

1 x M.2 Key E 2230 slot for Wi-Fi (USB 2.0 + PCIe signal)

1 x M.2 Key M 2280 slot for NVMe storage (PCIe x4 signal only)

Operating temperature range from –40°C to +60°C (requires special RAM and SSD)

Supply voltage 9 to 60 V DC. Phoenix-type VDC power input connector

Dual DDR5 SO-DIMM memory slots (up to 96 GB)

Optional Hailo AI accelerator via M.2 (up to 26 TOPS)

1x M.2 M-Key NVMe PCIe x4 (2242/2260/2280)

1x M.2 E-Key 2230 for Wi-Fi/Bluetooth

2x SATA III ports for storage expansion

1x HDMI and 3x DisplayPort outputs (up to 8K resolution)

1x 2.5GbE and 1x 1GbE RJ45 LAN ports

4x COM ports (2x RS-232/422/485 selectable)

3x USB 3.2 Gen 2 (2x Type-A, 1x Type-C), 1x USB 3.2 Gen 1, 4x USB 2.0

8-bit programmable GPIO header

Line-in/Line-out audio ports (Realtek ALC897)

Wide-range DC IN: 12–36 V via 3-pin terminal block

Operating temperature: -20°C to 60°C

Dimensions: 253 x 201 x 111.8 mm

Weight: 5.25 kg

Wall-mountable design for flexible installation

8//6-core Cortex A78AE v8.2 64-bit Arm CPU

8GB/16GB LPDDR5

1x M.2 2280 M-Key NVMe

Supports 1x M.2 2230 E-Key, 1x M.2 3042/3052 B-Key

2x Nano SIM slots

4x RJ45 GbE or 4x M12 PoE (optional configuration)

3x USB 3.2 Type-A ports

2x USB 2.0 Type-A, 1x USB 2.0 Type-C, 1x USB 2.0 Micro-USB

2x DB9 COM ports (RS-232/422/485) and 1x DB9 CANbus

HDMI output with max. resolution 3840x2160@60Hz

Operating temperature -20°C to 60°C

Dimensions: 277 x 180 x 62 mm

Weight: 3.5 kg

Wall mounting ready

DC IN 12V–24V via 3-pin terminal block

Fanless PC with NVIDIA Jetson Orin module Up to 100 TOPS

4GB/8GB 64-bit LPDDR5

1x M.2 2280 M-Key NVMe PCIe x4

Supports 1x M.2 2230 E-Key, 1x M.2 3042/3052 B-Key

2x Nano SIM slots

2x RJ45 GbE

3x USB 3.2 Type-A ports

2x DB9 COM ports and 1x DB9 CANbus

HDMI output with max. resolution 3840x2160

Operating temperature -20°C to 60°C

Dimensions: 152 x 112 x 62 mm

Weight 1.4 kg,

Wall mounting and DIN-Rail

DC IN 12V-24V with 3-pin terminal block

Supports Intel® 14th/13th/12th-Gen Core™ 24C/ 32T 35W/ 65W LGA1700 CPU

1x PCIe x16 slot@Gen3, 16-lanes PCIe signals in Cassette for installing an NVIDIA® graphics card up to 130W TDP (Max. graphics card dimension is 188 mm(L) x 131 mm(W), dual slot allocation)

Support NVIDIA® RTX series GPU card up to 130W TDP

5 x 2.5GbE and 1xGbE with on special request PoE+ (ports 3~6)

1 x USB 3.2 Gen2x2 (20 Gbps) port in type-C connector with screwlock

4 x USB 3.2 Gen2x1 (10 Gbps) ports in type-A connectors

2 x USB 3.2 Gen1x1 (5 Gbps) ports in type-A connectors7 x USB 3.2

2 x USB 2.0

2 x RS232/422/485 (COM1/2), 2 x RS232 (COM3/4)

1 x Mini PCIex, 1 x Full-size mini PCI Express socket

M.2 2280 M key socket (Gen4x4) supporting NVMe SSD

Accommodates two 2.5" SATA HDD/ SSD with RAID 0/ 1 support*

1 x VGA 1920x 1200, 1 x DVI-D 1920x1200, 1 x Display port 4096x2304

MezIO™ interface for add-on expansion

CE/FCC Class A, according to EN 55032 & EN 55035

240 mm (W) x 225 mm (D) x 110.5 mm (H)

-25°C to 60°C wide temperature rugged operation (need to have special RAM and SSD)

Power suppply: DC 8~48V

Model 0: No PCI/PCIe expansion

Model 1: 1 x PCI/PCIe slot

Model 2: 2 x PCI/PCIe slots - supports GPU cards up to 130W

CPU: Intel® Core™ i9/i7/i5/i3 (14th/13th/12th generation, LGA1700, max. 65W TDP)

RAM 2x DDR5 SO-DIMM, ECC/non-ECC, up to 5600 MHz, max. 64 GB

2x 2.5" SATA

3x mSATA sockets

1x M.2 Key M for NVMe SSD

2x GbE LAN (upgradable to 2x 10 GbE LAN upon order)

Up to 2x PCI/PCIe slots

1x M.2 + 2x Full-size Mini PCIe

Support for CMI and CFM modules (including for I/O expansion, ignition control, and PoE+)

2x DisplayPort

1x VGA

Up to 8x USB (USB 3.2 Gen2 and USB 2.0)

4x COM (RS-232/422/485)

9–48 VDC input, with ignition control

Operating temperature: -40 °C to 70 °C

Certifications: Military: MIL-STD-810G, Transportation: EN50155 (EN 50121-3-2), Safety: UL, cUL, CB, IEC/EN 62368-1

Supports Intel® OpenVINO™

Intel® ESDQ Certified: Edge Insights for AMR Software Stack

The system is assembled according to your needs. Contact us for advice and pricing.

14/13/12th Gen Intel® Core™ Series 65W max

2x DDR5 4800 MHz SO-DIMM Socket, 64GB max

1x DP, 1x HDMI, 1x VGA

1x MXM 3.1 Type A/B for GPU module

1x 2.5GbE and 1x 1GbE LAN, 

1x 20Gbps USB3.2 Gen2 x2, Type C Connector

3x 10Gbps USB3.2 Type A, 4x 5Gbps USB3.2 Type A

4x M.2 NVMe SSD or SATA SSD

Operating temperature -40°C to 70°C

Power Input 9-48 VDC

Dimension 260 x 200 x 85 mm

Support OS: Windows®11, Windows®10, Ubuntu Desktop 22.04 LTS

MIL-STD-810H

Powered by NVIDIA® Orin™ NX or Orin™ Nano SoM bundled with JetPack
IP66 waterproof and dustproof
4x PoE+ GbE via M12 X-coded connectors
1x CAN FD
1x RS232 via M12 A-coded connectors
-25°C to 70°C fanless operation (No throttling at 70°C with 20W TDP Mode)
225 x 136 x 55 mm low-profile design
8V to 35V wide-range DC input with built-in ignition power control

Powered by NVIDIA® Orin™ NX or Orin™ Nano SoM with JetPack
IP66 waterproof and dustproof
6x GMSL2 car cameras via FAKRA Z connector (requires camera manufacturers to have dedicated drivers)
(We can offer GMSL camera with driver support)
1x CAN FD
1x RS232 via M12 A-coded connectors
-25°C to 70°C fanless operation (no throttling at 70°C with 20W TDP mode)
225 x 136 x 55 mm low profile design
8V to 35V wide range DC input with built-in ignition current control

Fanless design (embedded heat pipe cooling solution)

12/13 generation CoreTM i9/i7/i5/i3 processor (Alder Lake-S/Raptor Lake-S)

Up to 60W GPU MXM module expansion

802.3af (15.4W)/802.3at(25.5W) Gigabit PoE ports

DP x2 + HDMI x 1 and DVI x 1 (supports 4 independent displays)

On/off delay control / configurable ignition current control

Supports TPM 2.0 and Time-Sensitive Networking (TSN)

Two mPCIe for optional WiFi/3G/4G/GPS or I/O expansion supported

Front-accessible I/O

1 x M.2 B for storage or 5G/LTE +1 x M.2 E-key for WiFi/BT

1 x M.2 M for NVMe SSD

285x230x 90 mm (9.84" x11.50" x 3.54"), fanless 285x230x110 mm (9.84" x11.50" x 4.33"), w/ FAN

DC 9~36V input

CE, FCC Class A, E-mark

optional extras