NVIDIA® Jetson Orin™ Nano with up to 1024 CUDA cores

8-core Arm® CPU and 4GB/8GB LPDDR5 RAM

1× GbE LAN and 2× USB 3.2 + USB-C

HDMI 2.0 with 4K output

Integrated 128GB NVMe SSD (M.2 2280)

Supports Wi-Fi module via M.2 E-key

9–24V DC input, low power consumption

Operation from -25°C to +50°C

Ideal for compact AI, IoT and vision solutions

Intel® Core™ i7-1255U (Alder Lake, 7nm)

Intel® Iris® Xe Graphics

Intel® Alder Lake Platform

TDP 15W

1 × DDR5 SO-DIMM, max 64 GB DDR5

1 × M.2 NVMe/NGFF 2280 SSD

1 × SATA 3.0 (6Gb/s)

2 × Gigabit LAN (Realtek RTL8111)

2 × HDMI 1.4 (up to 4K 60Hz)

Audio Intel® High Definition Audio, microphone input and SPK output

4 × USB 3.0

4 × USB 2.0

2 × RS-232 (DB9)

1 × mini-PCIe for Wi-Fi/Bluetooth or 3G/4G module (only one active at a time, must be ordered separately)

Built-in SIM card slot (for 3G/4G module)

Fanless aluminum design

Power supply DC 12–19 V (recommended 19 V / 4.74 A)

Power consumption Typical < 20 W

Dimensions (W×D×H) 193.9 × 127 × 57.2 mm

Weight 1.0 kg net / 1.5 kg gross

Color and material Black anodized aluminum, fully enclosed housing

Operating temperature –20 °C to +60 °C (requires special RAM, SSD must be specified if the PC is to be delivered as a complete unit)

Humidity 10–90% RH (non-condensing)

Features Wake-on-LAN, Automatic Wake-up (AWAL), Watchdog, RTC

Supported operating systems: Windows 10/11, Linux, WES 7/10

Mounting VESA/wall mounting via 4 mounting brackets

Certifications CE, FCC, RoHS

Dual DDR5 SO-DIMM memory slots (up to 96 GB)

Optional Hailo AI accelerator via M.2 (up to 26 TOPS)

1x M.2 M-Key NVMe PCIe x4 (2242/2260/2280)

1x M.2 E-Key 2230 for Wi-Fi/Bluetooth

2x SATA III ports for storage expansion

1x HDMI and 3x DisplayPort outputs (up to 8K resolution)

1x 2.5GbE and 1x 1GbE RJ45 LAN ports

4x COM ports (2x RS-232/422/485 selectable)

3x USB 3.2 Gen 2 (2x Type-A, 1x Type-C), 1x USB 3.2 Gen 1, 4x USB 2.0

8-bit programmable GPIO header

Line-in/Line-out audio ports (Realtek ALC897)

Wide-range DC IN: 12–36 V via 3-pin terminal block

Operating temperature: -20°C to 60°C

Dimensions: 253 x 201 x 111.8 mm

Weight: 5.25 kg

Wall-mountable design for flexible installation

8//6-core Cortex A78AE v8.2 64-bit Arm CPU

8GB/16GB LPDDR5

1x M.2 2280 M-Key NVMe

Supports 1x M.2 2230 E-Key, 1x M.2 3042/3052 B-Key

2x Nano SIM slots

4x RJ45 GbE or 4x M12 PoE (optional configuration)

3x USB 3.2 Type-A ports

2x USB 2.0 Type-A, 1x USB 2.0 Type-C, 1x USB 2.0 Micro-USB

2x DB9 COM ports (RS-232/422/485) and 1x DB9 CANbus

HDMI output with max. resolution 3840x2160@60Hz

Operating temperature -20°C to 60°C

Dimensions: 277 x 180 x 62 mm

Weight: 3.5 kg

Wall mounting ready

DC IN 12V–24V via 3-pin terminal block

Fanless PC with NVIDIA Jetson Orin module Up to 100 TOPS

4GB/8GB 64-bit LPDDR5

1x M.2 2280 M-Key NVMe PCIe x4

Supports 1x M.2 2230 E-Key, 1x M.2 3042/3052 B-Key

2x Nano SIM slots

2x RJ45 GbE

3x USB 3.2 Type-A ports

2x DB9 COM ports and 1x DB9 CANbus

HDMI output with max. resolution 3840x2160

Operating temperature -20°C to 60°C

Dimensions: 152 x 112 x 62 mm

Weight 1.4 kg,

Wall mounting and DIN-Rail

DC IN 12V-24V with 3-pin terminal block

Model 0: No PCI/PCIe expansion

Model 1: 1 x PCI/PCIe slot

Model 2: 2 x PCI/PCIe slots - supports GPU cards up to 130W

CPU: Intel® Core™ i9/i7/i5/i3 (14th/13th/12th generation, LGA1700, max. 65W TDP)

RAM 2x DDR5 SO-DIMM, ECC/non-ECC, up to 5600 MHz, max. 64 GB

2x 2.5" SATA

3x mSATA sockets

1x M.2 Key M for NVMe SSD

2x GbE LAN (upgradable to 2x 10 GbE LAN upon order)

Up to 2x PCI/PCIe slots

1x M.2 + 2x Full-size Mini PCIe

Support for CMI and CFM modules (including for I/O expansion, ignition control, and PoE+)

2x DisplayPort

1x VGA

Up to 8x USB (USB 3.2 Gen2 and USB 2.0)

4x COM (RS-232/422/485)

9–48 VDC input, with ignition control

Operating temperature: -40 °C to 70 °C

Certifications: Military: MIL-STD-810G, Transportation: EN50155 (EN 50121-3-2), Safety: UL, cUL, CB, IEC/EN 62368-1

Supports Intel® OpenVINO™

Intel® ESDQ Certified: Edge Insights for AMR Software Stack

The system is assembled according to your needs. Contact us for advice and pricing.

14/13/12th Gen Intel® Core™ Series 65W max

2x DDR5 4800 MHz SO-DIMM Socket, 64GB max

1x DP, 1x HDMI, 1x VGA

1x MXM 3.1 Type A/B for GPU module

1x 2.5GbE and 1x 1GbE LAN, 

1x 20Gbps USB3.2 Gen2 x2, Type C Connector

3x 10Gbps USB3.2 Type A, 4x 5Gbps USB3.2 Type A

4x M.2 NVMe SSD or SATA SSD

Operating temperature -40°C to 70°C

Power Input 9-48 VDC

Dimension 260 x 200 x 85 mm

Support OS: Windows®11, Windows®10, Ubuntu Desktop 22.04 LTS

MIL-STD-810H

Supports NVIDIA® Jetson AGX Orin™

1792-core NVIDIA Ampere™ architecture GPU with 56 Tensor Cores

Supports 2 x GbE

Supports 8 GMSL cameras (Can be specially ordered with 4x PoE instead)

2 x RS-232/422/485

5 x USB

16 isolated DI/O (special request, not standard)

2 x isolated CAN Bus

HDMI 2.1, up to 8K@60 Hz

Operating temperature -25°C ~ +70°C (TDP: 30W)

DC 9~48V wide range power input and ignition power control

Fanless design (embedded heat pipe cooling solution)

12/13 generation CoreTM i9/i7/i5/i3 processor (Alder Lake-S/Raptor Lake-S)

Up to 60W GPU MXM module expansion

802.3af (15.4W)/802.3at(25.5W) Gigabit PoE ports

DP x2 + HDMI x 1 and DVI x 1 (supports 4 independent displays)

On/off delay control / configurable ignition current control

Supports TPM 2.0 and Time-Sensitive Networking (TSN)

Two mPCIe for optional WiFi/3G/4G/GPS or I/O expansion supported

Front-accessible I/O

1 x M.2 B for storage or 5G/LTE +1 x M.2 E-key for WiFi/BT

1 x M.2 M for NVMe SSD

285x230x 90 mm (9.84" x11.50" x 3.54"), fanless 285x230x110 mm (9.84" x11.50" x 4.33"), w/ FAN

DC 9~36V input

CE, FCC Class A, E-mark

optional extras