Intel® Core™ i7-1255U (Alder Lake, 7nm)

Intel® Iris® Xe Graphics

Intel® Alder Lake Platform

TDP 15W

1 × DDR5 SO-DIMM, max 64 GB DDR5

1 × M.2 NVMe/NGFF 2280 SSD

1 × SATA 3.0 (6Gb/s)

2 × Gigabit LAN (Realtek RTL8111)

2 × HDMI 1.4 (up to 4K 60Hz)

Audio Intel® High Definition Audio, microphone input and SPK output

4 × USB 3.0

4 × USB 2.0

2 × RS-232 (DB9)

1 × mini-PCIe for Wi-Fi/Bluetooth or 3G/4G module (only one active at a time, must be ordered separately)

Built-in SIM card slot (for 3G/4G module)

Fanless aluminum design

Power supply DC 12–19 V (recommended 19 V / 4.74 A)

Power consumption Typical < 20 W

Dimensions (W×D×H) 193.9 × 127 × 57.2 mm

Weight 1.0 kg net / 1.5 kg gross

Color and material Black anodized aluminum, fully enclosed housing

Operating temperature –20 °C to +60 °C (requires special RAM, SSD must be specified if the PC is to be delivered as a complete unit)

Humidity 10–90% RH (non-condensing)

Features Wake-on-LAN, Automatic Wake-up (AWAL), Watchdog, RTC

Supported operating systems: Windows 10/11, Linux, WES 7/10

Mounting VESA/wall mounting via 4 mounting brackets

Certifications CE, FCC, RoHS

Intel® Core™ Ultra processor (Meteor Lake-H)

2 versions:

Intel® Core™ Ultra 7 processor 155H (16 cores, 28W TDP)

Intel® Core™ Ultra 5 processor 125H (14 cores, 28W TDP) Standard model

Equipped with multiple compute units, CPU, GPU (Intel® Arc™ GPU, applicable to H-series) and NPU (Intel® AI Boost), the system delivers high performance and efficient AI acceleration in a single platform.

Supports DDR5-5600 SO-DIMM memory, up to a maximum of 96 GB.

4 x USB 3.2 Gen.2 (Type-A)

2 x USB 2.0 (Type-A)

1 × USB Type-C (DisplayPort/USB 10Gbps support)

1 x USB (DisplayPort/USB 10Gbs with 30W power delivery support)

1 × HDMI 1.4b

3 × DisplayPort (of which 2 via USB Type-C).

3 x 2.5 GbE LAN ports with TSN (Time-Sensitive Networking)

1 x 1GbE port.

2 x 2.5" swappable HDD/SSD bays

1 x full-size PCI Express Mini Card (USB + PCIe signal)

1 x M.2 Key E 2230 slot for Wi-Fi (USB 2.0 + PCIe signal)

1 x M.2 Key M 2280 slot for NVMe storage (PCIe x4 signal only)

Operating temperature range from –40°C to +60°C (requires special RAM and SSD)

Supply voltage 9 to 60 V DC. Phoenix-type VDC power input connector

Dual DDR5 SO-DIMM memory slots (up to 96 GB)

Optional Hailo AI accelerator via M.2 (up to 26 TOPS)

1x M.2 M-Key NVMe PCIe x4 (2242/2260/2280)

1x M.2 E-Key 2230 for Wi-Fi/Bluetooth

2x SATA III ports for storage expansion

1x HDMI and 3x DisplayPort outputs (up to 8K resolution)

1x 2.5GbE and 1x 1GbE RJ45 LAN ports

4x COM ports (2x RS-232/422/485 selectable)

3x USB 3.2 Gen 2 (2x Type-A, 1x Type-C), 1x USB 3.2 Gen 1, 4x USB 2.0

8-bit programmable GPIO header

Line-in/Line-out audio ports (Realtek ALC897)

Wide-range DC IN: 12–36 V via 3-pin terminal block

Operating temperature: -20°C to 60°C

Dimensions: 253 x 201 x 111.8 mm

Weight: 5.25 kg

Wall-mountable design for flexible installation

8//6-core Cortex A78AE v8.2 64-bit Arm CPU

8GB/16GB LPDDR5

1x M.2 2280 M-Key NVMe

Supports 1x M.2 2230 E-Key, 1x M.2 3042/3052 B-Key

2x Nano SIM slots

4x RJ45 GbE or 4x M12 PoE (optional configuration)

3x USB 3.2 Type-A ports

2x USB 2.0 Type-A, 1x USB 2.0 Type-C, 1x USB 2.0 Micro-USB

2x DB9 COM ports (RS-232/422/485) and 1x DB9 CANbus

HDMI output with max. resolution 3840x2160@60Hz

Operating temperature -20°C to 60°C

Dimensions: 277 x 180 x 62 mm

Weight: 3.5 kg

Wall mounting ready

DC IN 12V–24V via 3-pin terminal block

Fanless PC with NVIDIA Jetson Orin module Up to 100 TOPS

4GB/8GB 64-bit LPDDR5

1x M.2 2280 M-Key NVMe PCIe x4

Supports 1x M.2 2230 E-Key, 1x M.2 3042/3052 B-Key

2x Nano SIM slots

2x RJ45 GbE

3x USB 3.2 Type-A ports

2x DB9 COM ports and 1x DB9 CANbus

HDMI output with max. resolution 3840x2160

Operating temperature -20°C to 60°C

Dimensions: 152 x 112 x 62 mm

Weight 1.4 kg,

Wall mounting and DIN-Rail

DC IN 12V-24V with 3-pin terminal block

14/13/12th Gen Intel® Core™ Series 65W max

2x DDR5 4800 MHz SO-DIMM Socket, 64GB max

1x DP, 1x HDMI, 1x VGA

1x MXM 3.1 Type A/B for GPU module

1x 2.5GbE and 1x 1GbE LAN, 

1x 20Gbps USB3.2 Gen2 x2, Type C Connector

3x 10Gbps USB3.2 Type A, 4x 5Gbps USB3.2 Type A

4x M.2 NVMe SSD or SATA SSD

Operating temperature -40°C to 70°C

Power Input 9-48 VDC

Dimension 260 x 200 x 85 mm

Support OS: Windows®11, Windows®10, Ubuntu Desktop 22.04 LTS

MIL-STD-810H

Rugged embedded PC for industrial edge AI, machine vision, and deep learning

Supports 12th/13th/14th Gen Intel® Core™ processors (up to 65 W)

Supports up to 96 GB DDR5 memory

Dual or single full-length GPU expansion option with combined 500 W power budget

4× hot-swappable 2.5" SATA bays + multiple M.2 slots 

Supports RAID 0 / 1 / 5 / 10

4× 2.5GbE LAN (optional 10GbE), 6x USB 3.2 Gen1x1 , 2x RS-232/422/485

Modular design for scalable I/O with expansion modules (CMI/CFM)

Temperature operation: –40 °C to 70 °C (depending on CPU config)

Power input: 9 - 48VDC

Os support: Windows 10/11, Ubuntu 22.04 LTS

Certified to MIL-STD-810H and other industrial standards for shock, vibration, and safety

Powered by NVIDIA® Orin™ NX or Orin™ Nano SoM bundled with JetPack
IP66 waterproof and dustproof
4x PoE+ GbE via M12 X-coded connectors
1x CAN FD
1x RS232 via M12 A-coded connectors
-25°C to 70°C fanless operation (No throttling at 70°C with 20W TDP Mode)
225 x 136 x 55 mm low-profile design
8V to 35V wide-range DC input with built-in ignition power control

Supports NVIDIA® Jetson AGX Orin™

1792-core NVIDIA Ampere™ architecture GPU with 56 Tensor Cores

Supports 2 x GbE

Supports 8 GMSL cameras (Can be specially ordered with 4x PoE instead)

2 x RS-232/422/485

5 x USB

16 isolated DI/O (special request, not standard)

2 x isolated CAN Bus

HDMI 2.1, up to 8K@60 Hz

Operating temperature -25°C ~ +70°C (TDP: 30W)

DC 9~48V wide range power input and ignition power control

Fanless design (embedded heat pipe cooling solution)

12/13 generation CoreTM i9/i7/i5/i3 processor (Alder Lake-S/Raptor Lake-S)

Up to 60W GPU MXM module expansion

802.3af (15.4W)/802.3at(25.5W) Gigabit PoE ports

DP x2 + HDMI x 1 and DVI x 1 (supports 4 independent displays)

On/off delay control / configurable ignition current control

Supports TPM 2.0 and Time-Sensitive Networking (TSN)

Two mPCIe for optional WiFi/3G/4G/GPS or I/O expansion supported

Front-accessible I/O

1 x M.2 B for storage or 5G/LTE +1 x M.2 E-key for WiFi/BT

1 x M.2 M for NVMe SSD

285x230x 90 mm (9.84" x11.50" x 3.54"), fanless 285x230x110 mm (9.84" x11.50" x 4.33"), w/ FAN

DC 9~36V input

CE, FCC Class A, E-mark

optional extras